Pbフリー対応について

　SynQorはPbフリー対応を検討中です。
　下記内容のPhase 1のみPbフリー対応済です。
　従って実質的に完全にPbフリー対応とは言えませんのでご注意ください。
　また、Moduleの実装用PinについてもPbフリー化未対応です。
1. SynQor Module使用のPCB Board上のPbフリー化（対応済）
2. Moduleアセンブリ用の半田ペーストpbフリー化（未対応：今後 Sn96.5/Ag3.0/Cu0.5 => Ni/Agへ変更予定）
3. Module上使用コンポーネントのPbフリー化（未対応：コンポーネント・メーカの対応時期に依存）

　Phaseは３つ有り、残る２つは電源Moduleを組み立てる際SynQorが使用する半田ペーストと使用コンポーネントのPbフリー対応を進めることです。
　Phse 1と2は同時に、SynQorの組み立てラインで実施される必要が有りますので、現在コンポーネントメーカーへ、Pbフリー対応を要求中です。



LEAD FREE INITIATIVE
As part of the global intiative to minimize the use of hazardous substances in the production of electronic equipment, SynQor has begun the process of eliminating the use of lead from its products and manufacturing processes. This Lead Free Initiative will be completed well in advance of the new EU regulation deadline set for July 2006. These process and material changes will have no impact on the form, fit, function or reliability of SynQor's converters. Our lead free initiative will be completed in three phases outlined below. Completion of phases 1 and 2 will ensure that SynQor converters achieve a Lead Free 2 status. Completing phase 3 will accomplish a Lead Free 3 status.
1. Change to a lead-free finish on printed circuit boards.
   Status: Nearly all PCBs now transitioned from HASL to ENIG (Electroless Nickel Immersion Gold).

2. Change to a lead-free solder paste in our assembly processes.
   Status: Lead free solder (Sn96.5/Ag3.0/Cu0.5) has been qualified for use in SynQor manufacturing processes. Solder plating on all IO pins being replaced with Ni/Ag.

3. Eliminate lead finishes and termination at the component level.
   Status: Working with other component manufacturers to eliminate lead in products.